Management from material purchasing to product delivery
For electronic assemblies and equipment
Inspection and verification using 3D X-Rays on PCBs with BGA and μBGA mounts, on cables and wires to ensure the correct connection or assembly of connectors, and on resins to ensure no bubbles are present, etc.
Full 3D automated optical inspection (AOI) of boards
Solder paste inspection (SPI) in 3D before mounting SMD components to verify correct application
Electrical check before SMD component mounting (on request)
Electrical flying probe tests on PCBs, injecting signals by means of mobile probes (continuous, short, values, polarity, etc.)
Functional tests, JTAG and software loading, and boundary scan
Wiring and cabling tests
Tests regarding continuity, high voltage, crimping hold, frequency, insertion loss, interferometry, etc.
Repair and Maintenance Services
From the collection of the product, to its delivery with a repair report.
Replacement stock and repairs within 24, 48 or 72 hours
Component repairs on electronic assemblies
Repairs on components and pieces of electronic equipment
Search for obsolete and alternative components
Tests on repaired products
In-situ wire and cable repairs